Rigid Flex PCB Design Primer for IoT/Wearable Product (2)

Via placement

When it pertains to positioning vias, there are particular rules you need to comply with given that vias can experience a great deal of tiredness as a result of bends and curvature. Again, the greater the variety of layers, the harder it becomes for vias to maintain their integrity since they need to preserve adherence with the circuit’s multiple layers. Take a 6-layer flex board, as an example. You need to make sure each layer internally adheres to all others while the circuit is stationary, along with when it’s flexing and flexing.

It is very important to position vias properly, remembering the bending movement of the wiring. In terms of spacing, it’s advised that you maintain a 20-mil clearance in between other vias that are being positioned on the exact same board, along with 20 mils from the vias to the edge of the board.

When you’re positioning the vias, you can specify locations on the PCB layout where the circuit is not mosting likely to be curved– or where any type of flexing is marginal– then place your vias in these areas.

When it comes to a rigid flex PCB board, you can position a minimum variety of vias in the flex PCB and attempt to keep most of the vias in the rigid PCB area. Also, when you’re putting the vias, the common by means of dimension utilized for flex circuit is 5 mils; nevertheless, depending on the application and element ratio, different using dimensions can be made use of.

The guideline is to maintain the vias in the proper location to ensure that they are executing their primary feature, which is to bring present. At the same time, the flex PCB should have the honesty to maintain the link and have the ability to withhold the tiredness of flexing.

Normal vs. stiff copper

As a wearable/IoT product designer, you might not find this certain area because manufacturers generate ready-to-use flex circuits. Nonetheless, it’s something that’ll make you savvier and possibly prevent design issues. For beginners, do not make use of electrolytically-deposited or ED copper in your flex circuits. ED copper is typically used for rigid PCBs; for flex PCB, it’s best to utilize rolled annealed copper.

Rolled copper is a substantially far better, more flexible material. Its surface is dealt with to make it smooth, implying it’s even more open to bending and flexing. Having stated this, some ED copper variations that are identified by unique grain frameworks can be extremely reliable for flex circuit flexing. In many cases, nonetheless, these ED coppers aren’t cost-efficient for the majority of wearable/IoT tools.

Rigid flex PCB

Flex PCB layer core thickness plays a vital role, as does maintaining the same coating thickness on all rigid areas. As for rigid wiring, you wish to avoid having 32 mils on one side and 62 on the other, for example, or else the sequential lamination procedure of rigid flex PCB fabrication comes into question and presents difficulties, so it’s prudent to maintain the exact same finish density in all rigid locations.

Generally, in a rigid PCB board, you have also number of layers. Comparative, in a flex PCB board you could have also and strange numbers. As an example, you might have 6 layers on the rigid side however just 3 layers on the flex side.

Layer building and construction when making the flex is likewise very important. You have to make certain you are decreasing the thinnest feasible building for the bend radius to enhance flexibility. If you have a five-mil Kapton material versus two-mil Kapton, flexibility and bend span will certainly be better for the two-mil Kapton.

Additionally, when developing rigid flex PCB, you have to make sure both adaptability and mechanical integrity. You have to take into consideration the fine equilibrium that comes with experience to make sure that the board being designed is flexible sufficient to perform its feature and reliable sufficient to sustain the flex and bend cycles that are being computed for its life cycle. Typically, you utilize half-ounce copper for flex PCB boards. In extreme cases, when high capability is required, you could utilize one ounce, however this is the exception, not the rule.

Something you have to do is perform a combined structure. For example, if you’re collaborating with an eight-layer rigid PCB board, you could have four flex layers or 2 layers of flex PCB.

Additionally, it’s finest to try to counter the traces from layer to layer in the bend area. This is since numerous traces going into the bend location threaten the flex PCB over the long term when it is flexing and bending an excessive variety of times. If there is an offset, then all the tension and pressure is not concentrated at one factor, but is rather dispersed throughout the circuitry. This means the anxiety and bend area are substantially much more flexible and dependable over a longer duration.

When it involves impedance controlled design, occasionally countering trace layers may not be possible. The factor for this is you have to have the trace in the closeness of a solid referral plane, which may not enable you to carry out a precise countered of traces. Impedance controlled design may make it testing to maintain staggered traces, which directly impacts mechanical flexibility and dependability.

What can be done is to balance out impedance controlled traces with subsequent layers. For instance, you could run one trace on layer 3, you can run the reference airplane on layer 4, and you could run the other matching staggered trace on layer 5. Therefore, you could balance out the traces between various layers, yet you still need to maintain the reference airplane in mind since resistance is a function of the signal’s range from the referral plane.

Balancing out impedance control traces with subsequent layers is but among numerous design considerations that need to be factored in when creating a flex PCB circuit-based wearable and/or IoT design. The factors clarified on in this write-up are the significant ones that should be considered, consisting of bend distance, bend proportion, stress produced at various locations, and via placement. Nonetheless, as you move along in your designs, you’ll find others to factor in depending upon whether you are targeting a customer, commercial, military/aerospace, or clinical electronics application.

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